Power management integrated circuit with integrated passive components

Since TechInsights launched the power management integrated circuit (PMIC) process analysis channel at the end of 2021, many devices have been analyzed. The contents include high-voltage grid drivers, automotive power conversion ICs, and even mobile power management integrated circuits. It is observed that more and more manufacturers try to integrate passive components into power management integrated circuit products in the way of co-packaging configuration or "full integration" with silicon IC itself.

Like all power electronics products, size, weight and power (SWaP) are key performance indicators. In order to improve the system efficiency, we need a more compact and portable system with higher power density. Under the condition that the power level of power management integrated circuit is relatively low, integration is a very ideal way and has theoretical feasibility.

An "integrated voltage regulator" (IVR) has received special attention. Since relatively small changes may also damage precision transistors in precision components such as CPU, it is necessary to use a voltage regulator circuit to provide stable constant voltage.

The input voltage of many consumer electronics products is 12 V (the latest server architecture is 48 V). The step-down conversion process of the final "load point" (PoL) inside the product provides the required voltage for CPU, GPU and other internal components (usually

Early attempt of "fully integrated" voltage stabilizer

So far, Intel's attempt at this technology is perhaps the most remarkable. Intel tried to adopt the so-called "fully integrated voltage regulator" (FIVR) solution on the 4th and 5th generation core microprocessors (Haswell and Broadwell). A paper presented at the 2014 APEC meeting demonstrated this method - integrating nonmagnetic inductors into grid array (LGA) packaging. A research paper submitted in 2016 showed more details of different inductors in the study, including uncoupled solenoid, staggered solenoid, shielded electroplated through-hole (PTH) ring and 3DL. The paper concludes that magnetic materials may have to be used in the future to meet the current density requirements. The early demonstration in 2011 showed the research of on-chip inductors, including magnetic CoZrTa envelope.

Since the sixth generation of products, Intel has abandoned the fully integrated voltage stabilizer scheme, one of the reasons seems to be that this method will generate additional heat near the CPU. It is rumored that this technology will be introduced again. As demonstrated by the demonstration on VLSI 2022, Intel is still studying this concept in some form.

Apple APL1028 integrated voltage regulator

Our dismantling channel has reported in detail the most important consumer electronics products that have been released. According to the analysis of 2021 MacBook Pro (16 inches) with M1 processor, we found that Apple APL1028 chip was set on the back of PCB in the cooling shell of M1 processor area. Since then, we have prepared a process analysis report on the power management integrated circuit of the device, and focused on the integrated inductor technology in the recent power management integrated circuit briefing.